APPLICATION

Photoresist on Cu Measurement

Photoresist thickness measurement on copper and PCB-related process substrates.

PRCuTFM-100
Photoresist on Cu Measurement sample

Sample Overview

  • ● Sample: Photoresist on Cu
  • ● Typical thickness: Application-dependent PR thickness range
  • ● Method: Reflectance-based thickness measurement, subject to sample condition and optical contrast.

Measurement Considerations

Model selection depends on the film stack, substrate, target thickness range, surface condition, and optical contrast.

All Applications

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Related TFM Systems

TFM system selection depends on sample geometry, required throughput, and measurement workflow.

TFM-100A compact reflectance-based TFM system for thickness measurement on wafer, glass, polymer, and coating samples.View →TFM-500A motorized TFM system for automated multi-point thickness mapping on wafer, glass, panel, and process samples.View →TFM-ContactA contact-style TFM package for large, curved, or installed coated parts where the probe moves to the part.View →TFM-RemoteTFM measurement system for external control, remote operation, and integration workflows.View →