Thin-Film Thickness Measurement Systems

TFM SERIES

VINE TFM Series Overview

Measurement method	Reflectance-based thin-film thickness measurement
Core workflow	Easy recipe setup. Practical fitting workflow. Designed for straightforward operation without requiring optical-model expertise.
Measurement workflows	Manual measurement, automated XY mapping, contact-style measurement, and external system integration
Available TFM systems	TFM-100, TFM-500, TFM-Contact, and TFM-Remote

MODEL SELECTION GUIDE

Choose the Right TFM System for Your Sample

Select the first candidate system based on sample size, measurement workflow, and integration needs.

Need / Workflow	Recommended Model	Sample Size / Handling	Best Fit
Manual sample checks	TFM-100	Standard stage: wafers up to 4 inches. Optional manual stage: wafers up to 12 inches. Larger sample sizes can be discussed.	General-purpose lab use, sample testing, and recipe-based checks.
Automated XY mapping	TFM-500	Supports wafers up to 12 inches and square samples up to 300 mm × 300 mm. A 370 mm × 470 mm stage option is available.	Multi-point mapping, uniformity review, and recipe-linked data storage.
Large / curved / installed coated parts	TFM-Contact	Various large or non-standard samples depending on probe access, surface shape, and fixture condition.	Coated parts that are difficult to place on a standard stage.
External control / integration	TFM-Remote	Sample size is defined by the customer-side stage, equipment, and optical setup.	Socket communication, remote operation, and automation workflows.

COMMON SPECIFICATIONS

TFM Series common measurement notes.

Shared measurement specifications. Applicable settings depend on sample condition, film stack, optical contrast, and the measurement recipe.

Measurement method	Reflectance-based thin-film thickness measurement
Typical measurement time	Typically 1–2 seconds for single-layer measurement
Spot size option	Approx. 40 µm with a 5× lens; approx. 20 µm with a 10× lens. The spot size depends on the selected lens and optical setup.
Supported layer count	Up to 3 layers in the current standard workflow.
Software	Lite included
PC / host connection	USB standard. Ethernet is available for remote-control or equipment-integration workflows.

Note: Multilayer structures may require additional fitting time depending on layer count and recipe conditions.

INSTALLATION REQUIREMENTS

Recommended space and power

Both systems can be installed on a standard laboratory table. The values below are recommended site provisions, not maximum power-consumption ratings.

Model	Recommended Installation Space	Power Input	Recommended Available Power
TFM-100	Approx. 1000 mm × 800 mm laboratory table	Single-phase AC 100–240 V, 50/60 Hz (220 V standard)	200 W
TFM-500	Approx. 1000 mm × 800 mm laboratory table	Single-phase AC 100–240 V, 50/60 Hz (220 V standard)	500 W

EXAMPLE REPEATABILITY CHECK

Example SiO₂ Same-point Repeatability

A SiO₂ reference sample was measured 10 times at the same point as an example repeatability check.

Actual results may vary depending on film stack, substrate, optical contrast, sample condition, and measurement recipe.

View detailed TFM-100 example

Example SiO2 same-point repeatability check table measured 10 times using a reference sample

MODEL OPTIONS

Standard, NIR, and XT model options.

Representative model ranges are shown below. The usable range depends on the sample and recipe conditions.

Representative Thickness Range by Model

10 nm 100 nm 1 µm 10 µm 100 µm 2,000 µm

Standard

15 nm–100 µm

NIR

1–500 µm

XT

100–2,000 µm

Model	Wavelength Range	Thickness Range*	Same-point Repeatability Reference
Standard	350–1050 nm	15 nm – 100 µm*	500 nm SiO₂ reference sample, n=10
NIR	750–1100 nm	1 µm – 500 µm*	850 / 1000 nm SiO₂ reference sample, n=10
XT	1005–1080 nm	100 µm – 2,000 µm*	2000 nm SiO₂ or transparent reference film, n=10

* Depending on sample condition, film stack, substrate, optical contrast, and measurement recipe.

APPLICATION EXAMPLES

Representative TFM applications.

These examples show representative sample types and coating structures. Each application page provides additional measurement considerations.

Oxide films on Si waferSiO₂ Thickness MeasurementOxide thickness measurement for semiconductor, display, MEMS, and optical device applications.View →Nitride dielectric and passivation filmsSi₃N₄ Thickness MeasurementSilicon nitride film measurement for dielectric, hardmask, and passivation-related processes.View →PR coating on copper substratePhotoresist on Cu MeasurementPhotoresist thickness measurement on copper and PCB-related process substrates.View →PR coating on wafer substratePhotoresist on Wafer MeasurementPhotoresist and SU-8 thickness measurement on wafer, glass, and process substrates.View →Transparent polymer and curved partsAnti-fog & Automotive HardcoatCoating thickness checks for goggles, optical covers, automotive hardcoat, lenses, and transparent plastic parts.View →Polymer coating on rough metal surfacePolymer on Rough Metal MeasurementExperience-based application for 6–10 µm polymer coating measurement on rough metal surfaces.View →Ultra-thin glass and glass wafer samplesUTG / Ultra-thin Glass MeasurementThickness evaluation for ultra-thin glass, glass wafer, and transparent substrate samples.View →Dielectric, barrier, passivation, and optical coating applicationsAl₂O₃ Thin Film MeasurementAluminum oxide films for dielectric, barrier, passivation, and optical coating applications.View →

Reflectance-based TFM systems for practical thickness measurement.