APPLICATION

Photoresist on Wafer Measurement

Photoresist and SU-8 thickness measurement on wafer, glass, and process substrates.

PRWaferSU-8
Photoresist on Wafer Measurement sample

Sample Overview

  • ● Sample: Photoresist / SU-8 on wafer, glass, or Si
  • ● Typical thickness: Sub-µm to thick PR/SU-8 examples
  • ● Method: Reflectance-based thickness measurement, subject to sample condition and optical contrast.

Measurement Considerations

Model selection depends on the film stack, substrate, target thickness range, surface condition, and optical contrast.

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Related TFM Systems

TFM system selection depends on sample geometry, required throughput, and measurement workflow.

TFM-100A compact reflectance-based TFM system for thickness measurement on wafer, glass, polymer, and coating samples.View →TFM-500A motorized TFM system for automated multi-point thickness mapping on wafer, glass, panel, and process samples.View →TFM-ContactA contact-style TFM package for large, curved, or installed coated parts where the probe moves to the part.View →TFM-RemoteTFM measurement system for external control, remote operation, and integration workflows.View →